Advanced Semiconductor Engineering, Inc (ASE) is a semiconductor packaging and test services provider. The company offers a wide range of products including Dual-in-Line, Quad, Ball-grid arrays, pin grid array, chip scale package or chip size package, system-in-package, flip chip, bumping, memory and discrete packages. ASE's services portfolio comprises semiconductor testing services such as wafer probing, front-end engineering testing, final testing of logic and mixed signal, memory semiconductors, and other test related services. It operates its business through four segments, namely, Packaging, Testing, Electronic Manufacturing Services and Others. ASE also provides integrated solutions for electronics manufacturing services related to computers, communications, peripherals, automotive, industrial, and storage and server applications. The company operates manufacturing facilities in Taiwan, South Korea, Japan, Singapore, Malaysia, China, Hong Kong and Mexico; and sales and marketing offices in Taiwan, the US, Belgium, Austria, Germany, and Japan among others. ASE is headquartered in Kaoshiung, Taiwan.
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