Amkor Technology, Inc.

Amkor Technology, Inc.
1900 South Price Road
CHANDLER
United States of America
Fax: 14-80-8218276
www.amkor.com

No. employees: 20,900
Turnover: 2,956.45 (US$m)
Financial year end: December

Company Overview

Amkor Technology, Inc. (Amkor) is a provider of semiconductor packaging and test services. It offers a comprehensive range of semiconductor testing services including wafer testing or probe, various types of final testing, strip testing and complete end-of-line test services up to and including final shipping. The company also provides a broad range of package formats and services designed to provide customers with a wide range of packaging solutions. The company provides turnkey packaging and test solutions including integrated circuit design, wafer fabrication, wafer probe, package design, assembly, and test and drop shipment services. The company together with its subsidiaries and branch offices operates in North America, Asia and Europe. Amkor is headquartered in Chandler, the US.

Top Competitors


Key Employees

James J. Kim

Chairman, Executive Board

Stephen D. Kelley

Director, President, Chief Executive Officer, Executive Board

James W. Zug

Director, Non Executive Board

Robert R. Morse

Director, Non Executive Board

Winston J. Churchill

Director, Non Executive Board

Roger A. Carolin

Director, Non Executive Board

John T. Kim

Director, Non Executive Board

John F. Osborne

Director, Non Executive Board

David Watson

Director, Non Executive Board

Gil C. Tily

General Counsel, Executive Vice President, Secretary, Chief Administrative Officer, Senior Management

Jooho Kim

Executive Vice President - Head of Worldwide Manufacturing Operations, President - Amkor Technology Korea, Senior Management

John Stone

Executive Vice President - Global Sales and Marketing, Senior Management

Joanne Solomon

Chief Financial Officer, Executive Vice President, Senior Management

Locations/Subsidiaries


1900 South Price Road,
CHANDLER,
United States of America
Fax: 1 480 8218276

Shiba Kouen Front Tower 14F,
2-6-3, Shiba kouen, Minato-Ku,
Tokyo,
Tokyo,
Japan
Fax: 81 3 54252831

491B River Valley Road,
Valley Point Office Tower #15-02/04,
Singapore,
Singapore
Fax: 65 63241183

Site K1 - Main Plant,
151, Dongil-ro, Seongdong-gu,
Seoul ,
South Korea
Fax: 82 2 4606007

3945 Freedom Circle,
Suite 830,
Santa Clara,
California,
United States of America
Fax: 1 408 4960392

Amkor Assembly & Test (Shanghai) Co., Ltd.

China

Amkor Technology Euroservices, S.A.R.L.

France

Amkor Wafer Fabrication Services, S.A.R.L.

France

Amkor Iwate Company, Ltd.

6-6 Kita-Kogyo-Danchi,
Kitakami,
Iwata,
Japan
Fax: 81 197 665294

Amkor Technology Japan, K.K.

Japan

Unitive International Ltd

Netherlands

Unitive International N.V.

Netherlands

Amkor Technology Philippines, Inc.

KM 22 East Service Road,
Special Economic Zone Cupang,
Muntinlupa City,
Philippines
Fax: 63 632 8440708

Amkor Technology Singapore Pte. Ltd.

2 Science Park Drive,
Sierra Leone
Fax: 232 63241183

Amkor Regional Treasury Center Pte. Ltd.

Singapore

Amkor Technology Singapore Holding Pte. Ltd.

Singapore

Amkor Technology Singapore Investment Pte. Ltd.

Singapore

Amkor Technology Singapore IP Holding Pte. Ltd.

Singapore

Amkor Technology Singapore Philippines Holding Pte. Ltd

Singapore

Amkor Technology Singapore Pte. Ltd.

Singapore

Amkor Technology Korea, Inc.

South Korea

Amkor Advanced Technology Taiwan, Inc.

Taoyuan,
Taiwan

Amkor Technology Taiwan Ltd.

Taiwan

Amkor Technology Limited

Cayman Islands,
United Kingdom

Amkor Worldwide Services LLC

Delaware,
United States of America

Guardian Assets, Inc.

Delaware,
United States of America

Products/Services

Products:

  • Fine Pitch Copper Pillar Flip Chip
  • 3D-Through Silicon Via (TSV) Wafer Finishing & Flip Chip Stacking Solutions
  • Package on Package (PoP | PSfvBGA | PSfcCSP | TMV PoP)
  • Flip Chip BGA (fcBGA)
  • Flip Chip Packaging Technology Solutions
  • FCmBGA (Flip Chip Molded Ball Grid Array)
  • fcCSP (Flip Chip CSP)
  • FlipStack CSP

Services:

  • IC Packaging / Semiconductor Packaging:
  • Stacked Die Packaging
  • Wafer Level Packaging
  • MEMS Packaging
  • Flip Chip Packaging
  • Through Silicon Via (TSV)
  • 3D Packaging
  • IC Test/Semiconductor Test:
  • Final Test Services
  • Wafer Probe Services
  • IC Test Development Services
  • IC Package Design Services
  • Semiconductor Turnkey Services

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