Qualcomm introduces 45 nm solutions

Wireless telecommunications R&D company Qualcomm has introduced new 45 nanometer single-chip solutions for smart phones. The QSC7230, QSC7830 and QSC7630 solutions feature high levels of integration with support for third-party operating systems and are scheduled to trial in the fourth quarter of 2008.

The QSC7230 solution is for high speed packet access (HSPA+) devices, QSC7830 is for CDMA2000 1xEV-DO Revision B devices, while the multi-mode QSC7630 solution is for both HSPA+ and EV-DO Revision B devices. According to Qualcomm, these solutions form part of the company's fifth generation mobile station modem 7xxx-series dual-core chipsets, which have power-saving features that enable 80 hours of music playback, 24 hours of talk time and a standby time of 30 days.

The products comes in a 12x12 package and offers a multi-band RF transceiver, a 600 MHz ARM11 application processor, Bluetooth 2.1 enhanced data rate (EDR), FM radio and global positioning system (GPS). Qualcomm claims that the QSC7230 supports UMTS Release 7 (HSPA+) and Cat. 9 UMTS for 10.2 Mbps HSDPA and 5.76 Mbps HSUPA data speeds. The QSC7830 supports EV-DO Rev. B for up to 14.7 Mbps on the downlink and 5.4 Mbps on the uplink. The QSC7630 supports both EV-DO Rev. B and HSPA+, while all three products are backward compatible with previous -generation networks.

Our new single-chip solutions offer the highest levels of integration with the most advanced modem technologies available in the wireless industry today, said Dr Sanjay Jha, chief operating officer and president of Qualcomm CDMA Technologies.

Earlier, the company had launched QSC6085, a 65 nm single-chip solution for CDMA2000 1xEV-DO Revision A in March 2007. It supported speeds up to 1.8 Mbps on the reverse link and 3.1 Mbps on the forward link as well as GPS capabilities, a 3 mega pixel camera, 15 frames per second (fps) video encode and decode capability.

Source: ComputerWire daily updates

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