IBM has introduced a chip making technology which it claimed to help mobile operators to handle explosive amount of data generated from mobile traffic.
The company's "9HP" silicon-germanium (SiGe) chip-making process will help mobile networks process increasing amounts of data to flow through network backbones in applications such as Wi-Fi, LTE cellular, wireless backhaul and high speed optical communications.
The new "9HP" SiGe technology will have a density of 90nm CMOS allowing better integration in a production qualified SiGe BiCMOS technology.
IBM's new SiGe BiCMOS technology claimed to offer higher performance, lower power and higher levels of integration than current 180nm or 130nm SiGe chips.
Compatible with company's 90nm low power CMOS technology platform, it will allow foundries to port a range of circuit blocks and standard cell library elements.
The 90nm foundry platform also offers an RF CMOS technology option which will offer foundries use them in broader choice for use in RF and mixed-signal applications.
IBM fellow David Harame said silicon-germanium is one of the key technologies that have enabled wireless operators to keep up with the explosive growth in data traffic generated from mobile handsets.
"Before SiGe, the high-performance chips used in base stations and optical links were built using expensive, esoteric processes. SiGe provides the necessary performance as well as integration and cost savings via its CMOS base."