For the semiconductor back-end process
Toshiba and its Chinese subsidiary, Toshiba Semiconductor (TSW), have entered into a definitive agreement with back-end process specialist Nantong Fujitsu Microelectronics, on forming a manufacturing joint venture in China for the semiconductor back-end process.
Under the agreement, TSW is expected to fold its back-end process facilities into a joint venture that will initially be 80% owned by TSW and 20% by NFME; and the cooperative relationship will regard NFME as a strategic partner in the back-end process area.
Following establishment of the JV, TSW will retain capabilities in manufacturing management and function as a local base for Toshiba to promote an outsourcing system for the back-end process.
The agreement is based on the memorandum of understanding between the companies executed in November 2009, and the companies expect to start operation of the joint venture Wuxi Tongzhi Microelectronics Co, in April 2010.
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