Billings plunged 32% compared to corresponding quarter in 2012
Global semiconductor manufacturing equipment billings have reached $ 7.31bn during the first quarter of 2013, according to a SEMI’s latest report.
The report revealed that the billing was up 8% over the fourth quarter of 2012 and 32% less compared to corresponding quarter in 2012.
During the quarter, global semiconductor equipment bookings reached $7.78bn, down 23% over Q1 2012, and 14% higher than the fourth quarter of 2012.
Taiwan topped the list of quarterly billings data by region with its billing reaching $2.83bn, up 60% over Q1 2012, followed by North America with 33% drop in billings to $1.53bn; while Korea reported 74% drop to $860m and Japan with 45% decline to $710m.
China’s semiconductor billings declined by 23% during the quarter to $550m, while ROW reported 14% plunge to $450m and Europe’s billings slumped 54% to $380m.