Wafer fab equipment spending down 47% on year ago
Worldwide semiconductor capital equipment spending totaled $16.6bn in 2009, a decrease of 45.8% compared to $30.66bn in 2008, according to final results by Gartner.
According to the report, the overall worldwide wafer fab equipment (WFE) spending declined 47%, while back-end equipment (BEE) decreased 40%, as both areas were hit hard by reductions in capital spending. The automated test equipment segment sales fell 53% in 2009, resulting in a market size of $1.15bn.
Despite a 38% decline in revenue in 2009, Applied Materials increased its worldwide market share to 15.1% up from 13.2% in 2008. Tokyo Electron returned to the second position with a share of 9.9%, overtaking ASML. These were followed by KLA-Tencor, Lam Research, Nikon, Dainippon Screen, ASM International, Novellus Systems and Teradyne with market shares of 5.6%, 5.1%, 4.7%, 3.8%, 3.3%, 2.6% and 2.4%, respectively.
Gartner said that the packaging and assembly equipment (PAE) market declined 32.2%, with sales of just over $2.7bn in 2009. In the traditional packaging space, companies selling copper wire bonders performed substantially better than the overall market.
Dean Freeman, research vice president for semiconductor manufacturing research group at Gartner, said: In the memory sector, continuing losses resulting from plunging prices drove memory capital spending down 54% from an already depressed 2008 level. Logic and mixed-signal spending declined 26% as manufacturers concentrated on technology upgrades to the next line width to position themselves for the recovery.
“By the end of the year, the major companies resumed spending, with a focus on implanting the latest technology throughout their organizations. We expect this trend to continue in 2010, with technology upgrades accounting for the majority of spending – at least through the first half of the year.