IBM Corp is offering to build third party application specific integrated circuits in its copper-based CMOS 7S manufacturing process. First to sign up are Silicon Graphics Inc and network company Juniper Networks. The first copper ASICs are expected to roll out of the fabs in January 1999.
IBM Corp is offering to build third party application specific integrated circuits in its copper-based CMOS 7S manufacturing process. First to sign up are Silicon Graphics Inc and network company Juniper Networks. The first copper ASICs are expected to roll out of the fabs in January 1999.