German electronics group Siemens’ semiconductor arm, Infineon Technologies AG and Motorola Inc announced yesterday that they had successfully produced chips using 300mm wafer technology. Munich-based Infineon said it expects to make 64MB memory chips using this technology commercially available within nine months.
German electronics group Siemens’ semiconductor arm, Infineon Technologies AG and Motorola Inc announced yesterday that they had successfully produced chips using 300mm wafer technology. Munich-based Infineon said it expects to make 64MB memory chips using this technology commercially available within nine months.
