To install Ramtron’s F-RAM semiconductor process technology in IBM’s wafer manufacturing facility
US semiconductor maker Ramtron International has entered into a foundry services agreement with IBM, to install Ramtron’s ferroelectric random access memory semiconductor process technology in IBM’s Burlington, Vermont, advanced wafer manufacturing facility.
Ramtron said that, once installed, the new foundry supply will serve as a foundation for the introduction of new ferroelectric random access memory (F-RAM) semiconductor products.
Ramtron expects to generate first production wafers during 2010 on the IBM 0.18-micron wafer manufacturing process. IBM will become Ramtron’s third foundry supplier for its F-RAM semiconductor products, along with Fujitsu and Texas Instruments.
Bob Djokovich, COO of Ramtron, said: We look forward to increased manufacturing capacity through our foundry relationship with IBM to help meet the growing demand for Ramtron’s F-RAM semiconductor products. This new foundry will provide a manufacturing platform for our new product development initiatives, which will drive new market opportunities for Ramtron. We have high confidence in IBM Microelectronics and believe that the addition of its process development and foundry services will help Ramtron serve the future needs of F-RAM customers around the world.