UMC will use IBM’s support and knowledge to improve its internally developed 14nm FinFET
Semiconductor company United Microelectronics (UMC) has joined IBM Technology Development Alliances to develop 10nm CMOS process technology.
As part of the deal, UMC will use IBM’s support and knowledge to improve its internally developed 14nm FinFET technology in order to provide low-power technology for mobile computing and communication products.
The jointly developed 10nm process technology is expected to meet the requirements of the UMC customers, for which it will send an engineering team to join development work in Albany, New York.
IBM Semiconductor Research & Development VP Gary Patton said that the company’s alliance allows the partners to leverage its combined expertise and collaborative research and technology development to address the demanding needs for advanced semiconductor applications.
"UMC is a strong addition to the alliance," Patton added.
UMC CEO Po Wen Yen said, "We look forward to collaborating closely with IBM, leveraging their deep technology expertise to shorten our 10nm and FinFET R&D cycles and create a win-win situation for UMC and our customers."
Both the 14nm FinFET and 10nm technologies will be implemented at UMC’s Tainan, Taiwan research and development site.
The agreements between UMC and IBM expands their 2012 agreements for development of prior nodes, including 14nm FinFET.