Meeting high-speed AMD AM3, Intel Core i3, i5, and i7 processors demands
OCZ Technology, a provider of solid-state drives (SSDs) and memory modules for computing devices and systems, has unveiled Xtreme Thermal Exchange (XTE) and Blade 2 high-speed desktop memory, which provide optimal balance of DDR3 performance and cooling efficiency in one offering.
The Blade 2 Series features a new finned anodised aluminum heatsink design for thermal management, and are available in 2,400Mhz and 2,133Mhz performance kits.
The new additions also includes the Platinum XTE and Gold XTE Series, to be deployed in premium 2133Mhz, 2000Mhz, and 1600Mhz offerings, coupled with a low-profile anodised aluminum heatspreader design to offset high temperatures that can damage DRAM ICs.
The company said the new memory series are developed to meet the demand for high-speed AMD AM3, Intel Core i3, i5, and i7 processors.
OCZ Technology chief marketing officer Alex Mei said the new XTE and Blade 2 DDR3 memory series featuring new compact, efficient heatspreader designs, and these hand-tested kits are the ideal offering for overclockers gaming and productivity applications, and are optimised for the latest generation of platforms from Intel and AMD.