The new programme focuses on meeting IBM’s technology requirements through its partners in the Semiconductor Research and Development Alliance
TEL NEXX, a subsidiary of Tokyo Electron U.S. Holdings has signed a new multi-year agreement with IBM to jointly develop a new 3D semiconductor packaging programme.
The new programme focuses on meeting IBM’s technology requirements through its partners in the Semiconductor Research and Development Alliance.
Under the development of new programme, TEL NEXX will contribute its advanced production tools, including the Apollo for physical vapor deposition (PVD), the Stratus for electrochemical deposition (ECD) to study both complex substrates and tool design.
TEL NEXX president Tom Walsh said enhanced Apollo PVD technology promises an economically efficient application for barrier seed deposition.
"Stratus ECD will be deployed in developing plating interconnects, among other 3D structures. We’re aiming to meet levels of productivity and reliability that solve problems only now being formulated in IBM’s advanced labs," Walsh said.
IBM’s next generation server products are challenged to demonstrate trouble-free lifetimes of up to twenty years, which can be met through processing environment provided by the PVD and ECD production tools.