Imbera Electronics has launched a new integrated module board technology, available across its full range of turnkey manufacturing services.
According to the company, the integrated module board (IMB) technology allows original equipment manufacturers and original design manufacturers to produce smaller boards, in a cost-effective manner by making simple adaptations to existing manufacturing processes.
Unlike traditional surface mount technology, using Imbera’s IMB technology, components are embedded inside the core layer of the printed circuit boards (PCB) while being electrically connected directly to the conductors on top of the core layer. Using the technology it is possible to embed all kinds of components including discrete passive components, application specific integrated passive components, bare dies and wafer level chip scale packaging. Imbera has said that since the manufacturing process utilizes standard PCB and SMA equipment and processes, adopting the technology does not require any heavy investments.
Imbera’s manufacturing process combines PCB manufacturing, component packaging and component assembly into a single manufacturing sequence. The benefit of this shortened process means less materials and equipment are needed, logistics are simplified and less labour is required. All this leads to a technology that provides further product miniaturization.
The company has said that due to its novel and advanced manufacturing process, IMB technology can be used to embed components inside a module substrate and manufacture a typical multi-chip-module/system-in-package product. Alternatively, IMB technology can be used to embed the components inside a motherboard to manufacture a system-in-board product. The technology can be utilized in various applications from simple products with only a few components to demanding products, such as mobile phones and other portable products requiring high packaging density as well as good electrical and thermal performance.
Jeff Baloun, CEO at Imbera, said: IMB technology has potential to satisfy the electronics market’s requirement for thinner, smaller products with enhanced electrical performance and functionality. The technology allows reductions to be made to the physical size of products whilst improving the cost of ownership through what is a very easy to adopt and versatile process. Our goal is to establish IMB technology as the industry standard for embedded packaging going forward.