The new application is targeted at new mass market segments such as entry level 3G handsets and machine-to-machine modules
Chip maker Intel has launched a new radio frequency application, SMARTi UE2p, that integrates 3G power amplifiers into radio frequency circuits.
The new system-on-chip (SoC) application is designed to reduce the complexity for developers as well as cut the associated total cost of ownership.
SMARTi UE2p integrates Intel’s 3G High Speed Packet Access (HSPA) radio frequency transceiver SMARTi UE2 and 3G power amplifiers on a single 65nm silicon die, allowing direct connection to the device battery.
It also supports multiple 3G dual band configurations for global operation with the Intel XMM62xx HSPA slim modem family.
Intel Architecture Group vice president and Multi-Com general manager Stefan Wolff said the SMARTi UE2p will simplify the product development and supply chain logistics with the reduction in component count and system complexity.
"This will allow our customers to introduce lower-cost 3G handsets and support the transition of the machine-to-machine market segment toward 3G-based connected devices to help enable the ‘Internet of things," Wolff said.
The new application is targeted at new mass market segments such as entry level 3G handsets and machine-to-machine modules, Intel said.