The new deal includes a NT$10.6bn ($363M) five-year bonds, a NT$10bn ($342M) bond for seven years and a NT$3bn ($102M) 10-year bond.
Contract chip manufacturer Taiwan Semiconductor Manufacturing has raised about NT23.6bn ($810m) through the sale of bonds.
The bond sale includes a NT$10.6bn ($363M) five-year bonds, a NT$10bn ($342M) bond for seven years and a NT$3bn ($102M) 10-year bond.
In late August 2012, the firm sold about NT$12.7bn ($435m) of five-year bonds and NT$9bn ($308m) of seven-year bonds.
Taiwan Semiconductor Manufacturing is also planning to begin construction of a new fab module at its Fab 14 gigafab at the SouthTaiwan Science Park in Tainan in 2013.
To be built as part of NT$500bn ($17bn) advanced capacity expansion plan by the firm, the construction on sixth phase module is being started seven months after the commencement of construction on phase-five.
TSMC co-chief operating officer Chiang Shang-yi was quoted by the Taipei Times as saying: "The factory will be the world’s first 12-inch factory producing 20-nanometer system-on-chips and the first 16-nanometer FinFET chip manufacturing site for TSMC."
Aimed at manufacturing 16-nm FinFET circuits in 2014, the phases 5 and 6 of the construction are expected to double the manufacturing capacity of the initial four phases.