Texas Instruments, has unveiled the RF360, the first smart integrated circuit platform to be developed specifically to meet the rigorous demands of the contact less government electronic identification market.
The RF360, the smallest smart IC platform in the market, will integrate Texas Instruments’s (TI) ultra-low power MSP430 microcontroller, advanced embedded Ferroelectric Random Access Memory (FRAM) and high-performance RF Analog Front-End (AFE) technologies. Leveraging a low power architecture and enhanced write capability, the RF360 smart IC platform will provide fast chip transaction speeds enabling governments to quickly and efficiently produce a multitude of passive electronic identification (ID) such as electronic passports (e-passports) and national ID cards.
TI’s RF360 platform will easily scale to meet future capabilities of government IDs such as larger amounts of memory for additional biometrics and multiple application credentials. It will further accommodate write-on-the-fly scenarios, including entry/exit information and electronic visas. The RF360 architecture will support both contact less and contact communication. The RF360 smart IC platform will support both open standard and native operating systems. It will also include easy-to-use software tools to enable third-party development similar to other TI semiconductor products.