Tokyo Electron (TEL) has signed $252.5m agreement to acquire FSI International
Tokyo Electron (TEL), a supplier of semiconductor and flat panel display production equipment, has signed $252.5m agreement to acquire US chipmaker FSI International, in a move to add surface preparation technology to its chip-making abilities.
The acquisition is also expected to enhance product line-up of Tokyo Electron through the combination of its own focus on batch and single wafer surface preparation tools.
FSI chairman and CEO Donald Mitchell said the combination of Tokyo Electron’s capabilities with surface preparation solutions from
FSI will ensure that semiconductor manufacturers have access to the advanced technology they need for success at 28nm and below.
"This transaction represents a compelling opportunity for FSI shareholders, employees and customers," Mitchell said.
The transaction is expected to be completed in the current calendar year.
The product line-up of Tokyo Electron include coater developers, oxidation/diffusion furnaces, dry etchers, CVD systems, surface preparation systems, gas cluster ion beam technologies and test systems.
FSI’s delivers surface conditioning equipment, technology and support services the production of microelectronics.
The US firm’s cleaning product portfolio includes batch and single-wafer platforms for immersion, spray and cryogenic aerosol technologies.