Taiwan Semiconductor Manufacturing Corporation has put a smile on the face of hard-pressed chip equipment makers by setting aside $1.4bn to upgrade its production lines next year.
The Taiwanese foundry giant will use the money to expand its leading edge capacity. Most of the cash will go towards expanding its 0.13-micron and 90-nanometer copper-based 300mm production capacity. Some of the investment will also be directed towards expanding its 0.18-micron and 0.15-micron capacity at its 8-inch fabs.
Despite a better outlook for the semiconductor industry, this has yet to translate into a meaningful upturn for makers of chip manufacturing gear. Last month trade body SEMI said the industry’s book to bill ratio hit 1 in August, meaning bookings for new orders roughly matched billings. This was the first time the ratio has hit one or more for over a year.
This article is based on an original published by ComputerWire.